Samsung says it has developed a thermally-enhanced chip-on-film (TECOF) package for the display driver IC which it claims will improve heat dissipation in large-screen, high-resolution LCD TVs.
The driver package improves thermal heat dissipation by 20 per cent over a conventional COF package, which will improve reliability, said the firm.
"A typical DDI requires at least 15V of power to drive large, high-resolution LCD TV panels that operate on broader frequency spectrums to reproduce high-speed video images. As a result, the driver IC generates greater heat, which can create reliability problems," said Samsung.
The package uses a new material for the thin metal tape component that can maximise heat dissipation. The company has also developed a new automated process for attaching the metal tape to the COF package. By applying the new TECOF package, the thermal emissions from the driver are quickly released via the metal tape, minimizing heat buildup.
In addition, heat build-up limits the number of channels a single chip can cover, creating an obstacle to reducing the total number of drivers per panel. With the new package, Samsung claimed the number of source drivers for a full-HD LCD TV is reduced from fourteen 414 channel-ICs to eight 720 channel-ICs.
“Package technology has become an important element, along with circuit design, in the development of display drivers for large-screen LCD TVs,” said Sa yoon Kang, v-p for Samsung’s System LSI Division.
Samsung has completed reliability testing of the new TECOF package and expects to ship product with the new TECOF package technology in the 2nd quarter of 2007.
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